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亚微米

网络DSM; submicron; Micron

亚微米

网络释义

亚微米

DSM

由于深亚微米（DSM）制程以后，ASIC的开发成本不断上升，因此标准产品中的FPGA是理想的选择之一（如图2）。FPGA的 …

submicron

电器电子专业英语词汇 ... submicrometer structure 亚微米结构 submicron 亚微米 submicron channel width 亚微米沟道宽度 ...

Micron

NMOS）工艺，而现在则普遍采用亚微米（Micron）CMOS工艺。DSP芯片的引脚数量从1980年的最多64个增加到现在的200 …

Very-Deep-Sub-Micron

...序分析等.另外,对 ASIC 的整个设计流程和沈亚微米(Very-Deep-Sub-Micron)设计技术作了详细的介绍.

sub um

* 精细到亚微米(sub um)的细胞直径 * 精细到亚皮升(sub pL）的细胞体积库尔特电阻抗原理，颗粒计数金标准！

lμ m

制备现代陶瓷材料所用粉末都是亚微米(＜ lμ m)级超细粉末，且现在已发展到纳米级超细粉。粉末颗粒形状、尺寸分布及相结 …

例句：

Secondly , the thickness of the beam is determined by the shallow dry etch , which leads to high precision controllability.

其次，亚微米梁的厚度由干法浅刻蚀梁区台阶深度决定，可以精确地控制；

Dust collector is designed to separate superfine particle or even sub-micron dust from process gas with micropore fiber material .

过滤除尘器是利用微孔超细纤维滤布分离气体和微细粉尘，乃至亚微米尘埃的主要设备。

Firstly, we analyze the main effect which influences the performance of devices in the deep submicrometer region.

首先分析了深亚微米工艺对器件性能的影响。

Then , the array was got soaked in liquid polyimide so as to make a sub-micron insulating layer , and it was evaporated.

然后阵列用液态的聚酰亚胺包裹，形成一个亚微米的绝缘层，然后风干。

In some embodiments, the release layer is formed from a dispersion of submicron particles that are coated onto a substrate .

在一些实施例中，所述释放层是由涂布于基板上的亚微米粒子的分散液形成。

The microstructure and properties of micron and submicron Ti(C, N)-based cermets were studied in this paper.

对用微米级和亚微米级基金属陶瓷的显微组织和性能进行了研究。

Sub -micron and nano beam is the fundamental structure of the device used in MEMS and NEMS.

特征尺度在亚微米和纳米梁结构是多种纳微机电器件的基本结构。

The submicron W and WC powder can be produced by using of violet tungstic .

用紫钨可以生产出亚微米级的钨粉和碳化钨粉。

The hydrated silicon dioxide with three layers structure of micron -submicron-millimicron was observed through TEM.

通过电镜实验，观察到水合二氧化硅具有微米亚微米纳米三次结构。

The polymer could be easily dispersed in water and as a result it formed spherical particles in semi-micros.

该共聚物易于分散在水中，并形成亚微米级球形微粒。

A resistance macromodel for deep - submicron process epi - type substrate based on the 2D device simulation is presented.

提出了一种基于二维器件模拟的深亚微米工艺外延型衬底的电阻宏模型。

With deep submicron technology , crosstalk noise becomes more and more serious .

随着深亚微米技术，串扰噪声问题越来越严重。

Microfabrication of crystalline structures by holographic lithography combined with visible light photopolymerization

亚微米结构的可见光聚合全息制作

Preparation of Submicron Monodisperse Polystyrene Microspheres by Seeded Emulsion Polymerization

乳液种子生长法制备亚微米单分散聚苯乙烯微球

Preparation of monodisperse micron - size polystyrene particles by emulsifier - free emulsion polymerization

无皂乳液聚合制备亚微米级单分散聚苯乙烯微球

Assembly of two-dimensional submicrometer ordered structures by electric -field-induced deposition against gravity

反重力电诱导自组装构造二维亚微米有序结构

Optical proximity correction for improving pattern quality in submicron photolithography

光学邻近校正改善亚微米光刻图形质量

亚微米

亚微米

DSM

submicron

Micron

Very-Deep-Sub-Micron

sub um

lμ m

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