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焊料槽

焊料槽

焊料槽

焊料槽

4

Silver and copper tend to not dross out of the solder pot .

银和铜不易在焊料槽中生成残渣。

5

If the Fe concentration increases in the solder pot this indicates that the solder pot is slowly dissolving because of the Pb-free alloy .

如果焊料槽中的铁浓度提高，则表明焊料槽因为无铅合金而缓慢溶解。

6

In this case the solder pot has to be changed or coated and the solder bar has to be replaced .

在这种情况下，必须更换或涂抹焊料槽，并更换焊料棒。

7

There is no industry control limits for Copper and Lead in SnAgCu solder pot.

目前行业中没有用于 SnAgCu 焊料槽中铜和铅的控制极限。

9

Adding pure tin to the pot will control the alloy .

向焊料槽中添加纯锡可以对合金进行控制。

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