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晶圆

网络Wafer; wafers; silicon wafer

晶圆

网络释义

晶圆

Wafer

晶圆（WAFER）：多指单晶硅圆片，由普通硅沙拉制提炼而成，是最常用的半导体材料。按其直径分为4英寸、5英寸、6英寸 …

wafers

他曾经预测说，现在的晶圆(wafers)直径会达到56英寸，现在的晶圆直径已经突破了12英寸。参考资料：http://huishushudema.…

silicon wafer

晶圆 (silicon wafer) 是一切集成电路芯片的制作母材。既然说到晶体，显然是经过纯炼与结晶的程序。

Wafer Fab

Index of Electrical Engineering Terms -... ... Wafer( 晶片) Wafer Fab( 晶圆) Wafer Fabrication( 晶圆加工) ...

On-wafer

此直接晶圆 (On-wafer) 测试系统，可进行 MEMS CRT 装置的特性描述作业 (Characterization)。"使用 LabVIEW 与 NI TestStan…

foundry

晶圆（Foundry）公司自从80年代中期诞生以来，得到了快速发展，目前形成了以TSMC,UMC和特征半导体"三大"公司为主局面 …

Monocrystal silicon Wafers

...主日本太阳能上游多晶硅(Polysilicon)及晶圆(Monocrystal Silicon Wafers)专业大厂 M. Setek，取得高质量的上游多晶硅与晶 …

MPW

但是，由于近年来多晶圆(MPW)项目和CPLD/FPGA技术的发展，尤其是可编程片上系统(SOPC——System-on-a-Programmabl…

例句：

The sub-threshold current test, which is often done at the wafer level, is a measure of how quickly the device will turn on and off .

亚阈区电流测试常常在晶圆片级进行。它是表示器件打开和关闭的快慢程度的参数。

The green "metal free tool " sign indicates that this machine is used in a part of the process prior to the addition of copper circuits .

绿色的 “非金属添加工具（metalfreetool ）”标志意味着硅晶圆必须得经过这台机器的处理以后，才能去添加铜质电路。

Area Contamination - Any foreign particles or material that are found on the surface of a wafer.

沾污区域 -任何在晶圆片表面的外来粒子或物质。

At Dresden 's other big "fab" , as chip-fabrication plants are called, is an indicator of another change that may prove just as damaging .

在德累斯顿的另外一个被称为芯片制造工厂的大晶圆厂则表现了一种纯粹破坏性的的改变。

Contamination Particulate - Particles found on the surface of a silicon wafer .

沾污颗粒 -晶圆片表面上的颗粒。

Alternatively, coating the wafer with a nanotube -containing solvent by spinning the disk like a phonograph record also had its problems .

而要是使晶圆像留声机唱盘那样旋转，让含有奈米碳管的溶剂附著在晶圆表面，也还是有问题。

Waviness - Widely spaced imperfections on the surface of a wafer .

波纹 -晶圆片表面经常出现的缺陷。

and, carrying out a second WAT process to test the electrical continuity of the first metallization layer .

以及进行第二晶圆允收测试（WAT ）步骤，以测试第一金属化层的导通性。

Minimal Conditions or Dimensions - The allowable conditions for determining whether or not a wafer is considered acceptable.

最小条件或方向 -确定晶圆片是否合格的允许条件。

that can be used for particle counting, measuring pattern resolution in the photolithography process, and metal contamination monitoring.

测试晶圆片 -影印过程中用于颗粒计算、量溶解度和检测金属污染的晶圆片。

Bonded Wafers - Two silicon wafers that have been bonded together by silicon dioxide, which acts as an insulating layer .

绑定晶圆片 -两个晶圆片通过二氧化硅层结合到一起，作为绝缘层。

at present , only a small number of ic design teams can be found in certain big companies and in fabless design houses.

现时只有一些大型公司及无晶圆设计公司内设有集成电路设计小组，但为数不多。

Waves - Curves and contours found on the surface of the wafer that can be seen by the naked eye .

波浪 -晶圆片表面通过肉眼能发现的弯曲和曲线。

The plant would be able to produce chipsets with details as fine as 90 nanometres across on 300 mm silicon wafers , the NDRC said .

国家发改委表示，大连工厂将能在 300 毫米晶圆片上，制造精度高达 90 纳米的芯片组。

This one looks rather like a sponge: thousands of parallel channels perforate a thin wafer of silicon .

这个棘齿看起来比较像纱布：数以千计的平行孔道贯穿一片薄薄的矽晶圆。

Deposition of nanotubes onto the wafer using a gas vapor required temperatures so high that the circuitry already in place would be ruined .

如要利用蒸气将奈米碳管建构在晶圆上，则需很高的温度，但这样一来，原来的电路就会毁坏。

The invention relates to a wafer-level lens module and a manufacturing method thereof.

一种晶圆级镜头模组及其制造方法。

A suitable solvent , chlorobenzene , was considered excessively toxic and had been banned from chip factories .

氯苯是种很合适的溶剂，但因为含有剧毒，晶圆厂严禁使用。

Ingot - A cylindrical solid made of polycrystalline or single crystal silicon from which wafers are cut .

研究人员目前正在扩展他们的工作，将单层石墨烯迁移到硅晶圆片上。

MEMC has been a pioneer in the design and development of wafer technologies over the past four decades .

memc 已率先在设计和开发的晶圆技术，在过去四十年。

Slip - A defect pattern of small ridges found on the surface of the wafer .

划伤 -晶圆片表面上的小皱造成的缺陷。

Lithographic tools for transferring Lilliputian circuitry onto a wafer cost up to $50 m a pop .

流行的用来移动微小电路到晶圆上的印刷工具价值 5千万美元。

Localized Light -Scatterer - One feature on the surface of a wafer , such as a pit or a scratch that scatters light .

局部光散射 -晶圆片表面特征，例如小坑或擦伤导致光线散射，也称为光点缺陷。

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